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Agilent 2.5 mm x 7.6 mm Rectangular LED Lamps Data Sheet
HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504
Description The HLMP-R100, -0301, -0401, -0504 are solid state lamps encapsulated in a radial lead rectangular epoxy package. They utilize a tinted, diffused epoxy to provide high on-off contrast and a flat high intensity emitting surface. Borderless package design allows creation of uninterrupted light emitting areas. The HLMP-R100 uses a double heterojunction (DH) absorbing substrate (AS) aluminum gallium arsenide (AlGaAs) red LED chip in a light red epoxy package. This combination produces outstanding light output over a wide range of drive currents. The HLMP-0301 has a high efficiency red GaAsP on GaP LED chip in a light red epoxy package. The HLMP-0401 provides a yellow GaAsP on GaP LED chip in a yellow epoxy package. The HLMP-0504 provides a green GaP LED chip in a green epoxy package.
Features * Rectangular light emitting surface * Flat high sterance emitting surface * Stackable on 2.54 mm (0.100 inch) centers * Ideal as flush mounted panel indicators * Ideal for backlighting legends * Long life: solid state reliability * Choice of 4 bright colors - DH AS AlGaAs Red - High Efficiency Red - Yellow - High Performance Green * IC compatible/low current requirements
Package Dimensions
7.62 (0.300) 6.99 (0.275) 7.62 (0.300) 7.11 (0.280) 0.46 (0.018) SQ. NOMINAL
CATHODE LEAD 29.21 (1.15) MIN.
2.54 (0.100) NOMINAL
BOTTOM VIEW
8.00 (0.315) 7.37 (0.290) 1.27 (0.50) NOMINAL NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. AN EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS. 3. THERE IS A MXIMUM 1 TAPER FROM BASE TO THE TOP OF LAMP.
2.54 (0.100) 2.16 (0.085)
2.54 (0.100) 2.29 (0.090)
SIDE VIEW
Selection Guide Luminous Intensity Iv (mcd) at 20 mA Min. Typ. 2.1 - 5.4 17.2 2.1 - 1.3 - 2.1 6.8 1.3 4.2 3.6 - 1.4 - 3.6 - 2.2 7.2 3.6 11.4 2.6 - 1.6 - 4.2 13.4 2.6 8.4 2.6 -
Color DH AlGaAs Red Red
Yellow
Green
Part Number HLMP-R100 HLMP-R100-FG0xx HLMP-0301 HLMP-0301-C00xx HLMP-0301-DECxx HLMP-0301-CD0xx HLMP-0401 HLMP-0401-B00xx HLMP-0401-D00xx HLMP-0401-CD0xx HLMP-0401-DEBxx HLMP-0504 HLMP-0504-B00xx HLMP-0504-DECxx HLMP-0504-CD0xx HLMP-0504-C00xx
Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads DD: Ammo Pack, Straight Leads Color Bin Options 0: Full Color Bin Distribution B: Color Bins 2 & 3 only C: Color Bins 3 & 4 only Maximum Iv Bin Options 0: Open (No Maximum Limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Color Options 1. As AlGaAs Red 3. High Efficiency Red 4. Yellow 5. Green Package Options R,0: Rectangular 2.5 mm x 7.6 mm
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Absolute Maximum Ratings at TA = 25C Parameter Peak Forward Current Average Forward Current[1] DC Current[2] Power Dissipation Reverse Voltage (IR = 100 A) Transient Forward Current[3] (10 s Pulse) Operating Temperature Range Storage Temperature Range
HLMP-R100 300 20 30 87 5 500 -20 to +100 -55 to +100
HLMP-0301 90 25 30 135 5 500 -55 to +100
HLMP-0401 60 20 20 85 5 500 -55 to +100
HLMP-0504 90 25 30 135 5 500 -20 to +100 -55 to +100
Units mA mA mA mW V mA C
Notes: 1. See Figure 5 to establish pulsed operating conditions. 2. For AlGaAs Red, Red, and Green Series derate linearly from 50C at 0.5 mA/C. For Yellow Series derate linearly from 50C at 0.2 mA/C. 3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum Ratings.
3
Electrical/Optical Characteristics at TA = 25C HLMP-R100 Sym. 2q1/2 Description Included Angle Between Half Luminous Intensity Points Peak Wavelength Dominant Wavelength Spectral Line Halfwidth Speed of Response Capacitance Thermal Resistance Forward Voltage Reverse Breakdown Voltage Luminous Efficacy 5.0 HLMP-0301 HLMP-0401 HLMP-0504 Min. Typ. Max. Min. Typ. 100 100 Max. Min. Typ. 100 Max. Min. Typ. 100 Test Max. Units Conditions Deg. Note 1. Fig. 6 Measurement at Peak Note 2.
lP ld Dl1/2 ts C RqJ-PIN VF VR
645 637 20 30 30 260 1.8 2.2 5.0
635 626 40 90 16 260 1.9 2.6 5.0
583 585 36 90 18 260 2.1 2.6 5.0
565 569 28 500 18 260 2.2 3.0
nm nm nm ns pF
VF = 0; f = 1 MHz
C/W Junction to Cathode Lead V V IF = 20 mA Figure 2. IR = 100 A
hv
80
145
500
595
lm/W Note 3.
Notes: 1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the luminous efficacy in lumens/watt.
1.0 AlGaAs RED GREEN
TA = 25 C
RELATIVE INTENSITY
0.5 YELLOW HIGH EFFICIENCY RED
0 500
550
600
650 WAVELENGTH - nm
700
750
Figure 1. Relative intensity vs. wavelength.
4
90 80
AlGaAs RED
2.5
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.3
YELLOW
1.2
HER
IF - FORWARD CURRENT - mA
70 60
HER
2.0
HER, YELLOW, GREEN
PEAK - RELATIVE EFFICIENCY
1.1
GREEN
1.0 0.9 0.8
AlGaAs RED
50
YELLOW
1.5
40 30 20
GREEN
1.0
AlGaAs RED
0.7 0.6 0.5
0.5
10 0 1.0 2.0 3.0 4.0 5.0
0 VF - FORWARD VOLTAGE - V
0.4
0
5
10
15
20
25
30
0
10
20
30 40
50
60
70
80
90
IDC - DC CURRENT PER LED - mA
IPEAK - PEAK CURRENT PER LED - mA
Figure 2. Forward current vs. forward voltage. VF (300 mA) for AlGaAs Red = 2.6 volts typical.
Figure 3. Relative luminous intensity vs. forward current.
Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current. hv (300 mA) for AlGaAs Red = 0.7.
IPEAK MAX. RATIO OF MAXIMUM PEAK CURRENT TO TEMPERATURE DERATED IDC MAX. MAXIMUM DC CURRENT
RATIO OF MAXIMUM TOLERABLE PEAK CURRENT TO MAXIMUM TOLERABLE DC CURRENT
4.0 3.0
10 9 8 7 6 5 4 3 2
10 K
f-R EFR ESH
300 H
z 100 H z
100 K Hz
2.0 1.5
30 KH z
10 KH z
3 KH z
1 KH z
RAT E-1 00 H z
IPEAK MAX. IDC MAX.
1 KH
3 KH z
300
Hz
Hz
z
1.0 1 10 100 1000 10,000 tP - PULSE DURATION - s HER, ORANGE, YELLOW, and GREEN
1
1
10
100
1000
10000
tp - PULSE DURATION - s AlGaAs RED
Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX).
20 30 40 50
10
0 1.0 0.8
0.6 60 70 80 90 0.4
0.2
10 20 30 40 50 60 70 80 90 100
Figure 6. Relative luminous intensity vs. angular displacement.
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Intensity Bin Limits Color Bin C D E F G H I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 0.5 2.4 2.4 3.8 3.8 6.1 6.1 9.7 9.7 15.5 15.5 24.8 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0
Red
Intensity Bin Limits, continued Intensity Range (mcd) Color Bin Min. Max. B 1.6 2.5 C 2.5 4.0 D 4.0 6.5 E 6.5 10.3 F 10.3 16.6 G 16.6 26.5 H 26.5 42.3 I 42.3 67.7 J 67.7 108.2 K 108.2 173.2 Yellow L 173.2 250.0 M 250.0 360.0 N 360.0 510.0 O 510.0 800.0 P 800.0 1250.0 Q 1250.0 1800.0 R 1800.0 2900.0 S 2900.0 4700.0 T 4700.0 7200.0 U 7200.0 11700.0 V 11700.0 18000.0 W 18000.0 27000.0 B 1.8 2.9 C 2.9 4.7 D 4.7 7.6 E 7.6 12.0 F 12.0 19.1 G 19.1 30.7 H 30.7 49.1 I 49.1 78.5 J 78.5 125.7 K 125.7 201.1 Green L 201.1 289.0 M 289.0 417.0 N 417.0 680.0 O 680.0 1100.0 P 1100.0 1800.0 Q 1800.0 2700.0 R 2700.0 4300.0 S 4300.0 6800.0 T 6800.0 10800.0 U 10800.0 16000.0 V 16000.0 25000.0 W 25000.0 40000.0
Maximum tolerance for each bin limit is 18%.
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Color Categories Color Category # 6 5 4 3 2 1 3 2 4 5 Lambda (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 593.0
Green
Yellow
Tolerance for each bin limit is 0.5 nm.
Mechanical Option Matrix Mechanical Option Code 00 01 02 DD
Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, minimum increment 1300 pcs/bag Tape & Reel, straight leads, minimum increment 1300 pcs/bag Ammo Pack, straight leads with minimum increment 2K/pack
Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information.
7
Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. * Recommended soldering conditions: Wave Soldering 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. Manual Solder Dipping - - 260 C Max. 5 sec Max.
* Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. * Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch)
Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time
Note: Refer to application note AN1027 for more information on soldering LED components.
TURBULENT WAVE
250
LAMINAR WAVE HOT AIR KNIFE
BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD
TEMPERATURE - C
200 150
FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
100 50 30 0 10
PREHEAT
20
30
40
50
60
70
80
90
100
TIME - SECONDS
Figure 7. Recommended wave soldering profile.
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www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2001-2005 Agilent Technologies, Inc. Obsoletes 5989-3267EN November 14, 2005 5989-4265EN

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